Topics: "Epitaxy, heterogeneous integration, functional polymers, and 2D/3D printing for wearable sensors, image sensors, hydrogen production, and photonic quantum computing"

Yeongin Kim Research Group in Department of Electrical and Computer Engineering/Materials Science and Engineering Program at University of Cincinnati seeks for passionate PhD students.

This project includes one of following areas: 1) Epitaxial thin-film growth, 2) Heterogeneous integration, 3) Syntheses of functional polymer, 4) 2D/3D printing, 5) Wearable sensors, 6) Image sensors, 7) Water-splitting electrolyzers for hydrogen production, and 8) Photonic quantum computing.

More information about the group can be found at the website: https://homepages.uc.edu/~kim4yg

The candidates will become one of the first alumni members in the future.

The opening is available until filled. The admission to PhD program for any semester and the adjustment of its start date can be arranged. Applicants should submit a CV to Professor Yeongin Kim (kim4yg@ucmail.uc.edu) to initiate the process.

1) A Bachelor's or Master's degree in Electrical Engineering, Materials Sciences, or related fields. The applicants will be admitted to PhD in Electrical Engineering (EE) or Material Science and Engineering (MSE) program.

2) Minimum of 3.0 grade point average (GPA) on a 4.0 scale in their highest degree earned.

3) Tests scores of TOEFL (Minimum 92), IELTS (Minimum 6.5), Duolingo (Minimum 110) and Pearson (Minimum 54). Waivers will be automatically given when their earned degree is from one of the listed countries where English is the official language, or waivers will be considered if the applicant has fulfilled one of the conditions:
https://grad.uc.edu/admissions/criteria/english.html

4) Required only for PhD in Electrical Engineering, not for PhD in Materials Science and Engineering: ETS GRE General Test score is required with the exception of any student that receives their bachelor's (BS) degree from an ABET accredited university in the United States with a GPA of 3.0+. Al

Full funding with tuition, stipends, and benefits will be provided.